For Glass and Silicon Wafer Cutting, Shorter Pulse Widths Yield Superior Results | Dec 2016 | Photonics.com
Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation - ScienceDirect
Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength | SpringerLink
Annealing, an important step in semiconductor materials processing, can be accomplished by rapidly heating the silicon wafer to a high temperature for a short period of time. The schematic shows a method
COMSOL simulation tutorial: Laser Heating and Thermal Expansion - By Amir H. Ghadimi - YouTube
COMSOL® simulation of the temperature field caused by the laser... | Download Scientific Diagram
Products – Siltronic / perfect silicon solutions
Laser Surface Structuring of Semiconductors and Functionalization | SpringerLink
Laser Heating – A Self Guided Tutorial - ppt video online download
Improvement of Laser-Crystallized Silicon Film Quality via Intermediate Dielectric Layers on a Glass Substrate | ACS Omega
Slip on the surface of silicon wafers under laser irradiation: Scale effect
Modeling the Pulsed Laser Heating of Semitransparent Materials | COMSOL Blog
Laser Heating of a Silicon Wafer
PHOTOVOLTAICS: New lasers advance efficiency and manufacture of silicon- wafer-based photovoltaic solar cells | Laser Focus World
Morphological features of silicon substrate by using different frequency laser ablation in air and water - ScienceDirect
Micromachines | Free Full-Text | Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties
Laser Heating of a Silicon Wafer COMSOL Tutorial - YouTube
Simulation model of a silicon wafer under laser irradiation. | Download Scientific Diagram
Materials | Free Full-Text | Epitaxial Growth of Silicon on Silicon Wafers by Direct Laser Melting
Tracking Material Damage with the Previous Solution Operator | COMSOL Blog
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COMSOL (Laser Heating of a Silicon Wafer) - YouTube
Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation - ScienceDirect
Simulation model of a silicon wafer subjected to 1064 nm laser irradiation. | Download Scientific Diagram
Study of die break strength and heat-affected zone for laser processing of thin silicon wafers: Journal of Laser Applications: Vol 27, No 3
Study of die break strength and heat-affected zone for laser processing of thin silicon wafers: Journal of Laser Applications: Vol 27, No 3
Thermal Effects on the Hydrogen Passivation of Silicon Wafers During Diode Laser Annealing - Ahmmed - 2018 - physica status solidi (a) - Wiley Online Library
